• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    the present invention relates to a dual interface transaction card that includes a metal card body having first and second surfaces. a contact-only transaction module is secure on the card body, the contact-only transaction module, including contact pads arranged on the first surface of the card body and including a first transaction circuit. a contactless transaction module is stuck in a void in the metal card body. the contactless transaction module includes a second transaction circuit and an antenna. a process for making the dual interface transaction card is also disclosed. The process includes the steps of building a metal card body having the first and second surfaces, attaching the contact-only transaction module to the metal card body, forming the void in the metal card body and securing the contactless transaction in a vacuum.
    公开号:BR112019013873A2
    申请号:R112019013873-0
    申请日:2018-01-10
    公开日:2020-03-03
    发明作者:Lowe Adam
    申请人:Composecure, Llc；
    IPC主号:
    专利说明:

    Descriptive Report of the Invention Patent for DOUBLE INTERFACE METAL CARD.
    [001] This application is related to and claims priority benefit for US Provisional Application No. 62 / 444,994, filed on January 11, 2017, and US Provisional Application No. 62 / 524,063 filed on June 23, 2017, whose contents are incorporated herein by reference in their entirety for all purposes.
    BACKGROUND OF THE INVENTION [002] Currently, most dual interface cards have a single integrated circuit chip that is connected to both the metal contacts visible and accessible from the outside of the card and the system embedded in the card for sending and receiving contactless signals, a system that for a metal card usually includes an auxiliary antenna (and its protective layer of ferrule) or a gap at the edge of the card body (which avoids the need for an auxiliary antenna) to facilitate the sending and receiving non-contact signals. The auxiliary antenna or gap at the edge of the card body usually modifies the structural rigidity of the card and / or deviates from the overall metallic behavior of the card, such as the metallic sound produced when a metal card is placed on a table. This metallic sound is a highly desirable feature of such cards for many who carry them. Consequently, the production of a metal transaction card with dual interface functionality (contact and non-contact), while maintaining the structural rigidity and the desired metallic sound of the card, is highly desired.
    SUMMARY OF THE INVENTION [003] One aspect of the invention comprises a double interface transaction card, comprising a metal card body having first and second surfaces; a contact-only transaction module and a contactless transaction module, arranged in a
    Petition 870190062352, of 07/04/2019, p. 16/59
    2/22 empty in the metal card body. The contact-only transaction module has contact pads arranged on one of the first and second surfaces of the card body and comprises a first transaction circuit, and the contactless transaction module comprises a second transaction circuit and an antenna. The first transaction circuit and the second transaction circuit can be customized independently.
    [004] In one embodiment, the contact pads are arranged on the first surface of the card body and the void comprises a pouch in the metal card body that is opened to the second surface of the card body. In other modalities, the bag can be open to the same side of the card as the contact pads. The contactless transaction module can be glued to the bottom of the bag with adhesive. The contactless transaction module may comprise one or more of an outer layer disposed flush with the second surface of the card body, a layer containing the second transaction circuit and the antenna, a ferrite layer, an adhesive layer and a layer of filling.
    [005] In another embodiment, the void comprises a through hole in the metal card body that extends from the first to the second surface of the card body. In this embodiment, the contactless transaction module may comprise a multi-layered plug or disk that has a first outer layer aligned with the first surface of the card body and a second outer layer aligned with the second surface of the card body. In this embodiment, an antenna layer located between the first and second outer layers may comprise the second transaction circuit and the antenna, and at least one filler layer may also be located between the first and second outer layers. A ferrite layer may be missing from the contactless transaction module
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    3/22 in this mode.
    [006] Another aspect of the invention comprises a process for making a dual interface transaction card. The process comprises the steps of (a) building a metal cardboard body having first and second surfaces; (b) embedding a contact-only transaction module in the metal card body; (c) the formation of a void in the metal card body; and (d) provision of a contactless transaction module in a vacuum. The contact-only transaction module has contact pads arranged on one of the first and second surfaces of the card body and comprises a first transaction circuit, and the contactless transaction module comprises a second transaction circuit and an antenna. The process may further comprise the step of customizing the first transaction circuit regardless of the customization of the second transaction circuit.
    [007] In one embodiment, the process steps may comprise the arrangement of the contact pads on the first surface of the card body, forming the void in the form of an open pouch for the second surface of the card body and having a bottom adjacent to the first surface of the card body and adhering to the contactless transaction module at the bottom of the bag. The contactless transaction module can be provided in the form of an adhesive comprising an outer layer configured to be flush with the second surface of the card body, an antenna layer containing the second transaction circuit and the antenna, a ferrite layer and an adhesive layer covered with removable liner paper, in which case the step of adhering the module to the bottom of the pouch comprises first removing the removable liner paper and then pressing the adhesive layer against the bottom of the pouch.
    [008] In another modality, the stages of the process comprise
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    4/22 the formation of a through hole extending from the first surface to the second surface of the card body and the arrangement of the non-contact transaction module in the through hole. The contactless transaction module can be supplied in the form of a multilayered plug or disk that has a first outer layer and a second outer layer, in which the arrangement of the non-contacting transaction module in the void comprises fitting the plug into the hole. pass that the first outer layer is aligned with the first surface of the card body and the second outer layer is aligned with the second surface of the card body.
    BRIEF DESCRIPTION OF THE DRAWINGS [009] According to common practice, the various characteristics of the drawings are not drawn to scale, unless otherwise indicated.
    [0010] Figure 1 is a schematic exploded view of an RF-protected adhesive from a set of exemplificative contactless modules.
    [0011] Figure 2A is a schematic drawing representing a cross-sectional view of an exemplary card having a contact-only module and a non-contact module, in which the non-contact module is arranged in a pocket formed in the card body.
    [0012] Figure 2B is a schematic drawing representing a plan view of the back face of the exemplary card in Figure 2A, showing the cross-sectional line corresponding to Figure 2A.
    [0013] Figure 3A is a schematic drawing representing a cross-sectional view of an exemplary card having a contact-only module and a non-contact module, in which the non-contact module is arranged in a hole formed in the card body.
    [0014] Figure 3B is a schematic drawing representing a plan view of the back face of the example card in Figure 3A,
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    5/22 showing the cross section line corresponding to Figure 3A.
    [0015] FIGURE 3C is a schematic drawing representing an alternative modality of an exemplary card having a non-contact module arranged in a through hole formed in the card body and held in place using a two-piece card construction.
    [0016] Figure 4A is a schematic drawing representing a detailed view of Figure 3A, in which the non-contact module is shown in the form of a plug or multilayer disk.
    [0017] Figure 4B is a schematic drawing, like FIGURE 4A, representing a non-contact module in the form of a separate non-contact transaction module, arranged in a plug or disk.
    [0018] Figure 4C is a schematic drawing, as in FIGURE 4A, which describes a non-contact module in the form of a separate non-contact transaction module inserted between several buffers or disks. [0019] Figure 5A is a schematic drawing representing a cross section of a multi-layered buffer or disk modality, in which the antenna layer is completely surrounded by filler material.
    [0020] Figure 5B is a schematic drawing representing a cross section of a multi-layered buffer or disk modality, in which the antenna layer is placed between the filling layers.
    [0021] Figure 5C is a schematic drawing representing a cross section of a multi-layered buffer or disk modality comprising a ferrite ring.
    [0022] Figure 5D is a schematic drawing representing a cross section of a multi-layered buffer or disk modality comprising a layered ferrite ring.
    [0023] Figure 6A is a schematic drawing representing a
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    6/22 sectional view of an exemplificative card having a pocket and through hole formed to accommodate a single dual interface module having contact and non-contact characteristics.
    [0024] Figure 6B is a schematic drawing that represents a plan view of the back face of the example card in Figure 6A, showing the cross section line corresponding to figure 6A.
    [0025] Figure 7A is a plan view of an exemplary dual interface module for insertion into the example body card of Figure 6A.
    [0026] Figure 7B is a side view of the exemplary double interface module of figure 7A, with a plug mounted on it.
    [0027] Figure 7C is a schematic drawing that represents a cross section of an example card that has a contactless module and a contact only module.
    [0028] FIG. 8 is a schematic drawing representing the pins of an exemplary contact-only module or of a contact faceplate.
    [0029] Figure 9 is a schematic drawing representing a modality in which the payment module is placed in the non-contact module housing and is connected to a front contact plate by means of dashes.
    DETAILED DESCRIPTION OF THE INVENTION [0030] The invention is best understood from the following detailed description when read in connection with the accompanying drawings, with similar elements having the same reference numbers.
    [0031] One aspect of the invention comprises a split, contact / contactless approach, with an RF-protected payment sticker and a contact-only payment module. This enables contactless payment capability, without requiring an auxiliary antenna on the card body or incorporating a gap at the edge of the body
    Petition 870190062352, of 07/04/2019, p. 21/59
    7/22 of the card. Contactless payment stickers and RF protected payment stickers are commercially available and have been deployed in the field (TBC Bank, 2016). Payment stickers with RF protection are also offered commercially by payment solution providers, such as Gemaito (Gemalto Inc, 2016). See, for example, the Gemalto Optelio contactless adhesive, http://www.gemalto.com/brochures-site/download-site/Documents/fs_optelio_contactless_sticker.pdf; and TBC Bank Payment Sticker, http://www.tbcbank.ge/web/en/pay-sticker, both of which are incorporated herein by reference. An exemplary construction of non-contact adhesives can be found in U.S. Pat. 8,186,603, also incorporated herein by reference.
    [0032] However, until now, these solutions have been used only as add-ons for cell phones, so that no application or mobile wallet is needed.
    [0033] In one aspect of the invention, the contactless payment module can be embedded within the metal card body as an adhesive insert. The ferrite inside the insert provides RF protection from the metal card body. A contact-only module, as is known in the art, is applied to the front of the card to allow contact-only transactions. In another aspect of the invention, the contactless payment module may comprise a disk or plug disposed in a through hole in the card. In certain embodiments, the contact-only module comprises a first IC chip and the contact-only module comprises a second IC chip, and each chip is independently customized. Thus, while each chip can be encoded with information corresponding to the same user, the digital codes transmitted by each chip are typically different, are read by different types of readers and, ultimately,
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    8/22 are decoded using information that resides in different memory locations. The terms disk and buffer are used interchangeably throughout this document, and the use of one should be understood as also encompassing the other. Insofar as the term disc can be understood as implying a round or cylindrical shape, the term plug should be understood as referring to an insert having any geometry capable of being retained in the through hole that is formed. It should also be understood that the through hole can also have any geometry, although its geometry is typically suitable for the geometry of the plug or disk (for example, similar, but slightly smaller in some modalities to facilitate a pressure adjustment, or similar, but having internal threads configured to fit with external threads of the plug or disk in other modalities). In other embodiments, the plug or disk may have a geometry that is substantially similar to that of the through hole, with the disk or plug having one or more features, such as guides, pins, protuberances, slots or other small differences designed to create interference or to fit with a coupling feature in the hole, to retain the disc or plug in the hole.
    [0034] Figure 1 represents an exploded view of a non-contact transaction module in the form of an RF 1 protected transaction adhesive inlay (inlay 1, hereinafter) according to an embodiment of the invention. The terms adhesive, embedded, adhesive embedded, disk, buffer, non-contact module and non-contact transaction module can be used interchangeably in this document.
    [0035] The inlay 1 comprises an outer coated layer 2, an antenna layer 4, a ferrite layer 6, a filler layer 10, an adhesive layer 12 and a removable paper coating 14. The individual layers can be arranged in the order
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    9/22 shown in figure 1, or alternatively, the layers can be arranged in a different order. The total thickness of the insert can be from 0.01 inches (0.254 mm) to 0.033 inches (0.84 mm), for example.
    [0036] In this embodiment, the filling layer 10 can be composed of any polymer susceptible to the construction of the inlay, such as PVC, PET, PETG, polycarbonate, PET, PLA, copolymers of the above or any other polymer known in the art. The filling layer 10 can change dramatically in thickness or composition, depending on the structure of the contactless payment component.
    [0037] Antenna layer 4 includes an integrated circuit that may contain software for open and closed circuit payment systems, loyalty, identification and medical / social benefits. This IC is connected to the antenna on the substrate. The antenna layer 4 is typically etched aluminum, but can use any antenna system known in the art, such as etched copper, copper wire or printed antennas using conductive inks such as nanosilver. Printing methods may include nanojet / inkjet (screen printing) or screen printing. The pouch for the RF-protected adhesive inlay can be a blind pouch or a partial through hole, as shown in more detail in figures 2 and 3.
    [0038] The outer layer 2 can be formed from paper or plastic and can be coated. A design can be printed on the outer layer 2. The design can be applied by printing, laser, perforation, embossing, etc. to convey the desired design. Printing methods can include nanojet / inkjet or screen printing.
    [0039] Although referred to here as a paper / plastic layer with reference to a common modality, it should be understood that the (s)
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    10/22 outer layer (s) of the non-contact transaction module (in any and all modalities described here) are not limited to just paper and / or plastic, and may comprise any materials or combinations thereof known in the art capable of properly transmitting signals to and from the antenna 4. Thus, the aesthetics of the non-contact transaction module may also include an external decorative layer comprising wood, leather, ceramics, crystal, protected or perforated metal, foil, or the like, to confer desired aspect of the card.
    [0040] The contactless transaction module 1 can be mounted in a card pocket. The pouch can be a blind pouch or a through hole, as will be described hereinafter with reference to figures 2A-3B.
    [0041] Figures 2A and 2B represent an example card 16 that has a contact-only module 20 and a non-contact module (in the form of inlay 1). The contact-only module 20, as is known in the art, can rest on a blind pouch 21 that is flush with the front surface 22 of the card 16 to allow contact-only transactions. The slot 1 can rest on a blind pocket 17 that is flush with the back surface 18 of the card 16, allowing RF transmission and thus payment transactions on only one side of the card (the side on which the pocket 17 opens) . The metal above the blind pocket 17 prevents RF transmission to the front of the card, but RF transmission through the top of the insert 1 is possible, since ferrite 6 provides shielding of the metal layer. The adhesive inlay antenna 1 is tuned for optimal performance to accommodate the effects of metal and ferrite. Although more convenient for mounting in an adhesive format comprising all the layers shown in figure 1 mounted in an inlay from which the liner 14 is removed from the adhesive
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    11/22 and the insert 1 pressed into place in bag 17, it should be understood that the non-contact module 1 for placement in bag 17 can have any number of constructions, including a construction in which there is no adhesive and the adhesive is applied to the hole before inserting the module. In other constructions, the antenna module inlay can be retained in the pocket other than stickers. Furthermore, it should be understood that multiple inserts 1, each having an adhesive layer 12, can be stacked on top of each other in pocket 17, with each insert 1 containing one or more layers necessary to complete the set. Similarly, the layers can be arranged in situ in the pouch by any method known in the art to hold them firmly in place, not limited to the adhesive bond.
    [0042] Figures 3A and 3B represent an example card 25 that has a contact-only module 20 and a non-contact module 24. Figures 3A and 3B show a construction using a through hole design. In this drawing, the non-contact module 24 in the form of a plug or payment disc 24 is snap-fit or threaded into a through hole 26 in card 25 that extends from the front to the back of card 25. The disc 24 is held in place (i.e. fixed) in hole 26.
    [0043] In some embodiments, the plug or disk 24 can be relatively rigid and permanently held in place within the body of the card. Due to the complete removal of the metal from the orifice 26, RF transmission from both sides of the card 25 is possible and ferrite in the cap or disc 24 is typically not necessary, giving the card 25 a higher level of performance.
    [0044] As shown in figure 4A, the plug or disk 24, like the inlay 1 of figure 1, may comprise a multilayered design that includes the antenna and the embedded IC layer, one or more
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    12/22 layers of filler above and / or below the antenna layer and one or more layers of paper / plastic coated externally, each of which is arranged to rest level with the respective surface of the card and can have a design. Alternative variants 24a and 24b of disk 24 are described below with reference to figures 4B and 4C, respectively.
    [0045] In other modalities of the disk 24a and 24b, illustrated in figures 4B and 4C, respectively, at least the antenna and the embedded IC layer comprising the non-contact module may be part of the embedding 44 or 46 (having at least adhesive layers and coating on one side) which is adhesive-bonded to a separate buffer or disc 42, 47 or 48, which may have an externally coated paper / plastic layer arranged to align with the outer surface of the card and, optionally, a filling layer. This inlay may have an outer surface designed to be flush with the outer surface of the card, such as inlay 44 shown in figure 4B, or, as shown in figure 4C, plugs 47 and 48 can be arranged on both sides of the inlay 46. Adhesive layers can be arranged in the inlay, the plug, or both. The multilayer design of each disc 24 / 24a / 24b may comprise layers that are connected to each other by any means known in the art, including adhesive.
    [0046] Thus, the methods for making the card can comprise any process for forming a card with a contact chip known in the art, in which the additional steps necessary to add non-contact capacity can be interposed at any point in the processing. The steps to add non-contact capacity include first creating a void in the card body, such as by laminating, engraving, punching, etc. The void can be in the form of a pocket 17, as shown in figure 2A, or through a
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    13/22 passage 26 as shown in figure 3A. Then, the contactless module is placed in the void. In the process shown in figure 2A, the placement of the non-contact module 1 comprises the adhesive bonding of a non-contact transaction insert 1 in bag 17. In one embodiment, the non-contact transaction module comprises an adhesive multilayer inlay 1, as shown in figure 1.
    [0047] In the process shown in figure 3A, the placement of the non-contact module 24 comprises the placement of a non-contact transaction disk or plug 24 in the through hole 26. This process may comprise pressure fitting, threading or arrangement by any other means known in the art, a module as shown in figures 3C and 4A-4C in the through hole. The non-contact module can be a multilayer module that comprises at least the antenna / IC module and the layers of paper / plastic coated on the outside and, typically, one or more layers of filling in figure 1. These modalities may not have a layer of ferrite and it typically has no adhesive or coating layers.
    [0048] As shown in figure 3C, in one embodiment, the metal card may comprise two pieces 300, 320 and module 340 may have at least two opposite radial flaps 360 and 380 adjacent to the through hole, which flaps are arranged with grooves in the body parts of the card, so that the tabs keep the insert in place. Although shown with grooves in both body parts 300 and 320, it should be understood that the grooves can be present in only one of the two parts. In other embodiments, the tabs can be thin enough that no corresponding grooves are needed. Although represented as two separate tabs, it should be understood that any number of tabs can be provided, including only a single tab in the form of a radial protuberance
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    14/22 continuum surrounding the entire periphery of the disk / buffer. In the embodiment shown in Figure 3C, the contact-only module 350 can be inserted into a through hole in the metal body part 300, and can have a similar flap or set of flaps and corresponding grooves to hold it in place. In other embodiments, the disk / plug, or one or more parts of it, can be snap-fit or bonded in an adhesive way to the through hole in the card, as shown in Figures 4A-4C. Module 40 can be inserted in a single step or the multiple layers of the module can be mounted in place in the corresponding through hole, as further explained in this document.
    [0049] In other types of discs / buffers, it may be desirable to include a ferrite component. In particular, the disk / buffer may include a ferrite component comprising a ferrite ring in one or more of the layers to protect the metal edges, but still allow RF transmission in both directions perpendicular to the plane of the card. The ferrite ring can be arranged over the entire thickness of the disk / buffer, just in one layer or in multiple layers. For example, as shown in figure 5C, a disk / buffer comprising outer design layers 60, filler layers 62, and antenna layer 64 as described herein, may have a ferrite ring 70 surrounding the entire periphery (but not the surfaces top and bottom of the disk / buffer). Although referred to as a ring, it should be understood that the ferrite can have any annular geometry, including circular, square, etc., and may or may not necessarily have the same shape as the disk / plug as a whole. The ferrite can be, without limitation, in the form of a coating or a sleeve in which the other layers are stacked. In another embodiment, as shown in figure 5D, a disk / plug 32 may comprise outer layers 80, filler layers 82 and antenna layer 84,
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    15/22 where ferrite 90 is arranged in only one layer. Although shown arranged in the antenna layer 84, it should be understood that ferrite 90 can be isolated in its own layer or layers, and can be present in any one, all or multiple, but less than all the layers in the stack (and, in addition, the stack is not limited to only the layers or all the layers shown). Thus, the ferrite component 90 may extend in the relevant dimension from the front surface of the card to the back surface of the card, or it may extend dimensionally less than from the surface to the surface.
    [0050] Furthermore, although represented in both figures 5C and 5D, it should be understood that the ferrite component may not necessarily be the outermost material and that other components (for example, filler material) may comprise the outer periphery and / or be located between the ferrite and the outer periphery of the disk / plug that is in contact or otherwise closer to the body of the card. However, the annular ferrite component is generally disposed on the outer periphery of the plug or disk or close to the outer periphery (i.e., relatively closer to the outer periphery than to a central axis of the disk or plug) to provide appropriate protection for the components. arranged in the ring formed by the ferrite component. Although the 70/90 ferrite ring is illustrated here in relation to a disk / plug modality configured for placement in a through hole in the cardboard body, it should be understood that this feature can also be applied to modalities intended to be placed in a bag blanks on the card body.
    [0051] In other embodiments, the process of placing the non-contact transaction cap or disk in the bag may comprise the provision of at least one first buffer or disk in the through hole and placement of a non-contact transaction module on top of
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    16/22 buffer or disk, as in the form of an adhesive inlay, as shown in figure 4B. In this embodiment, the contactless transaction inlay comprises at least the antenna / IC module, a first layer of paper / plastic coated externally to rest level with a card surface and the layers of adhesive and coating (the coating layer being removed) before gluing the adhesive to the plug, the plug may comprise the filler layer and a second layer of plastic / paper coated externally to rest with the other surface of the card In another embodiment, the process of placing the plug or transaction disc non-contact in the bag can comprise the arrangement of the first plug or disk in the through hole, placing a non-contact transaction module on top of the first plug or disk, and placing a second buffer or disk on the non-contact transaction module, as shown in figure 40. In this modality, the contactless transaction sticker comprises at least the antenna / IC module and one or more adhesive layers (with removable lining paper placed over the adhesive layer until the adhesive adheres to the buffer stage), and each buffer comprises at least one externally coated paper / plastic layer to rest level with an external surface of the carton, and typically also a filler layer, and may also include one or more adhesive layers. In this embodiment, the adhesive layers can be supplied as part of the buffer or the non-contact module, or both.
    [0052] It should be understood that in a multilayer disk or buffer as described above in relation to figure 4A, the assembly of the multilayer disk or buffer may comprise the provision of one or more of the layers as described here in the form of an adhesive inlay , and adhering this adhesive inlay to one or more of the other layers to assemble the multilayer component. O
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    The assembly process may comprise, for example, the assembly of a sheet containing multiple IO / antenna modules and external layers of paper / plastic Multiple distinct printed units aligned with each IC / antenna module and stamping or cutting of each disk or plug multilayer. from the multilayer sheet assembled to create the discs or tokens, they are then arranged in the through hole.
    [0053] Thus, in a multi-layer modality of the plug or disk 34 shown in figure 5B, the IC / antenna / 58 module can be interleaved between different filling layers 59a and 59b, just as it can be assembled by the method described above (with layers adhesives not shown in figure 5B). Module 58 and filling layers 59a and 59b are interspersed between two outer layers 54 and 56.
    [0054] In another embodiment of the plug or disk 36 shown in figure 5A, the layer 50 of the ICZ antenna module can be embedded in a filling layer 52 that wraps the IC module / antenna layer 50 on all sides. Filler layer 52 is interspersed between outer layers 54 and 56. Filler layer 52 may actually comprise two layers (not shown), each with a pocket formed to accommodate antenna 50, or a layer with a pocket and a layer covering the opening of the pocket or the two layers of filling may have no pockets and can be laminated together to create a sealed portion around the edges of the antenna / IC 50 module.
    [0055] In yet another embodiment, shown in figures 6A-7B, the card body 600 can have a configuration to accommodate a dual interface module. The body 600 can have a through hole 602 formed inside the pocket 604. The pocket 604 can be laminated to accommodate an inlay, such as the adhesive inlay 700 of figures 7A and 7B.
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    18/22 [0056] Adhesive inlay 700 comprises a first portion 704 having the ferrite and antenna structure as described here, and a second portion 702 configured to inductively engage the module and have no ferrite, Ferrite can be removed or omitted during the manufacture of the inlay 700, or the ferrite can be ground during the process of incorporating the module.
    [0057] As shown in the profile view of figure 7B, the insert 700 can also have a plug 706 connected to the module coupling area for the contact module to be embedded. The 706 plug can be any non-metallic material, such as plastic. An advantage of the configuration shown in figures 6A and 7B, is that it allows the use of a single dual interface module instead of two separate ICs (one for contact and one for non-contact). In the other modalities described here, contact-only and non-contact chips are not physically connected to each other or in communication with each other, meaning that they typically need to be customized separately. Having a single module increases the speed of customization when the card is assigned to a user. Although described with the contact module (including the integrated circuit (IC) shared by the contact and non-contact interfaces) embedded in the buffer, it should be understood that the common IC can be embedded in the buffer or the adhesive. The important thing is that the contacts exposed on the card surface (and embedded in the buffer) that physically connect to a card reader are connected to the same IC as the antenna structure (embedded in the sticker) used for a non-contact interface with a reader of cards.
    [0058] In an exemplificative implementation, the insert 700 is manufactured with the plug 706 connected to the insert non-contact module 700. Separately, the card body 600 is formed, the hole
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    19/22
    602 is laser cut and pouch 604 is laminated. The insert / plug combination is then inserted into the pouch / hole in the card body, and a module is embedded or otherwise attached to the plug, or the module can be embedded in the plug prior to Insertion into the bag / hole in the card body . The incorporation process may comprise the removal of the ferrite from the adhesive underlying the plug, or the adhesive can be manufactured with the ferrite removed prior to the insertion of the adhesive in the pouch, or before the attachment of the plug to the adhesive.
    [0059] In yet another modality, represented in figure 7C, the plug 756 (and the associated associated contact module) can be installed separately in the card body from the contactless module insert 754. The contactless module insert can have an RF antenna recorded or printed. In one method, bag 751 can first be formed in body 750, then the non-contact module insert 754 is inserted into the bag and then orifice 753 is worked into the contacts (not shown) of the non-contact module insert and the plug (and contact module) is connected to these contacts, such as via cable connection or flip-chip connection. In yet another embodiment, hole 753 and bag 751 are cut and plug 756 (and the contact module embedded in it) is inserted into the hole, with a connection (for example, contact pads, not shown) to the contact module exposed and then the 754 non-contact module housing is applied to the bag with the contacts (not shown) of the non-contact module housing corresponding to the connection to the contact module. Throughout the foregoing, it should also be understood that the term buffer refers to any insulation arranged around the contacts and any IC connected to it in hole 753. Although plug 756 is shown and described as an independent element in figures 7B and 7C , it is not limited to any particular construction, especially in modalities where contact and surrounding insulation
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    20/22 are arranged on the card separately from the non-contact module housing.
    [0060] In another exemplary construction, referring to figure 7C, instead of connecting directly through contacts to the payment module, the built-in antenna 754 of non-contact module can be connected inductively to a double interface module of inductive coupling (D1) integrated in the 756 buffer, such as a standard Di module known in the art.
    [0061] In yet another modality, the payment IC is mounted on the non-contact insert, such as by means of wire connection or flip-chip connection. The inlay may have a recorded or printed RF antenna. Embedding provides functionality for the card to perform contactless transactions. Figure 9 represents a card body 900 having a payment IC 906 mounted in non-contact insert 904. Figure 8 represents the standard 802 format of the contact pins of a contact module on an exemplificative 800 card. The dashes 908 for the pins 1-6 are executed from the payment IC for the contact module area and, for example, laminated on the card body or in the insert. A hole is laminated to accommodate the 802 contact pins on the front face of the card. A faceplate 902 of the false module without connected IC is connected to the traces 908 in the inlay so that the IC 906 in the inlay can conduct both contact and non-contact transactions. Each stroke is connected to the appropriate pin 1-6 on IC 906. In order for the front plate 902 to physically reach the grooves of the housing and make an electrical connection, copper pads (or electrically conductive) can be installed in the housing 904 or the face plate 902. The electrical connection between the faceplate and the inlay can be made, for example, by ACF tape, solder or conductive epoxy. Providing a direct link between the payment module 906 and the contactless antenna can help prevent
    Petition 870190062352, of 07/04/2019, p. 35/59
    21/22 problems that arise from poor connectivity between the contactless antenna and the payment module when they are only inductively coupled to each other.
    [0062] The card as described here is thus a complete metal card in the sense that it comprises a continuous metal edge and the metal card body has a unitary construction that is not interrupted with an auxiliary antenna embedded in the body itself metal. The non-metallic components in the pouch or in the through hole do not have the same detrimental effect on the metallic sound of the card as that of the antenna or the edge gap.
    [0063] In yet another modality, instead of being inserted into a bag or through hole, the non-contact module can be constructed as a full face layer that is adhesively glued to one side of the metal card. The non-contact module, thus constructed, can interact with the other component cards in any of the ways described here (that is, it can be customized separately in relation to the contact-only module, a single operational dual interface IC can reside in the full layer and connect by means of a contact pad to the front plate for contact only, or a single operational dual interface IC can reside on the card and can be connected to a full face layer only of antenna via contacts or via inductive coupling. without full face contact can have one or more additional layers attached to it, such as a layer comprising, for example, the magnetic strip, signature pad, barcode, cardholder photo, holograms, brand, security codes printed and the like.
    [0064] Although the invention is illustrated and described here with reference to specific embodiments, the invention is not intended to be limited to the details shown. On the contrary, several modifications to the details can be made within the scope and range of equivalents
    Petition 870190062352, of 07/04/2019, p. 36/59
    22/22 of the claims and without departing from the invention. In particular, although contactless modules are shown and described here as having particular layers, it should be understood that certain modalities may have more or less layers, and the layers may have a different order from top to bottom than those shown in the examples. Furthermore, insofar as an adhesive layer is shown and described in relation to certain embodiments, it should be understood that several other layers can be glued together without expressly revealing the nature of the connections between the layers. Although the contactless transaction module is shown and described in certain modalities as having an adhesive connection between the contactless module and the bottom of the bag, it should be understood that other types of connections can be used between the contactless module and the part bottom of the bag. [0065] Furthermore, although the adhesive can be supplied as part of a non-contact module in the form of an adhesive in some modalities, in other modalities, the adhesive can be applied to the pouch before placing a non-contact non-adhesive module in the pouch . In yet other embodiments, the adhesive can be supplied as part of an adhesive module and in the pouch. Finally, although the constructions described and shown here may be particularly suitable for use on cards having a metal card body, it should be understood that the card body can comprise any construction of materials or combinations thereof, including, but not limited to , metal, plastic, wood, leather, ceramics and laminates or hybrids comprising layers of more than one building material.
    权利要求:
    Claims (36)
    [1]
    1. Dual interface transaction card, characterized by the fact that it comprises:
    - a metal cardboard body having first and second surfaces;
    - a contact-only transaction module attached to the card body, the contact-only transaction module comprising contact pads arranged on the first surface of the card body and comprising a first transaction circuit;
    - a contactless transaction module trapped in a void in the metal card body, the contactless transaction module comprising a second transaction circuit and an antenna.
    [2]
    2. Dual interface transaction card, according to claim 1, characterized in that the first transaction circuit and the second transaction circuit are personalized independently.
    [3]
    3. Double interface transaction card, according to claim 1, characterized in that the void comprises a blind pocket open to the second surface of the card body.
    [4]
    4. Dual interface transaction card, according to claim 3, characterized by the fact that the contactless transaction module is adhesive-bonded to a lower part of the bag.
    [5]
    5. Dual interface transaction card according to claim 1, characterized in that the non-contact transaction module comprises an outer layer disposed in level with the second surface of the card body.
    [6]
    6. Dual interface transaction card, according to claim 5, characterized in that the non-contact transaction module still comprises a layer containing the second transaction circuit and the antenna, a ferrite layer and an adhesive layer.
    Petition 870190062352, of 07/04/2019, p. 38/59
    2/8
    [7]
    7. Dual interface transaction card according to claim 5, characterized in that the contactless transaction module still comprises a filling layer.
    [8]
    8. Dual interface transaction card according to claim 1, characterized in that the void comprises a through hole in the metal card body that extends from the first to the second surface of the card body.
    [9]
    9. Dual interface transaction card according to claim 8, characterized in that the non-contact transaction module comprises a multi-layered plug or disk that has a first outer layer aligned with the first surface of the card body and a second outer layer aligned with the second surface of the card body.
    [10]
    10. Dual interface transaction card, according to claim 9, characterized in that the contactless transaction module further comprises an antenna layer located between the first and second outer layers, the antenna layer comprising the second circuit and antenna.
    [11]
    11. Dual interface transaction card according to claim 10, characterized in that the non-contact transaction module still comprises at least one filling layer located between the first and second outer layers.
    [12]
    12. Dual interface transaction card, according to claim 10, characterized in that the contactless transaction module does not include a ferrite layer.
    [13]
    13. Dual interface transaction card according to claim 10, characterized in that the non-contact transaction module comprises an annular ferrite component disposed on or near the outer periphery of the plug or disk for at least a portion of a dimension from the first surface of the card to the second
    Petition 870190062352, of 07/04/2019, p. 39/59
    3/8 surface of the card.
    [14]
    14. Process for making a dual interface transaction card, the process characterized by the fact that it comprises the steps of:
    (a) constructing a metal cardboard body having first and second surfaces;
    (b) attaching a contact-only transaction module to the metal card body, the contact-only transaction module having contact pads arranged on the first surface of the card body and comprising a first transaction circuit;
    (c) forming a void in the metal cardboard body; and (d) fixing a contactless transaction module in the void, the contactless transaction module comprising a second transaction circuit and an antenna.
    [15]
    15. Process, according to claim 14, characterized by the fact that it still comprises the stage of:
    (e) customize the first transaction circuit, regardless of personalization of the second transaction circuit.
    [16]
    16. Process according to claim 14, characterized in that step (c) comprises the formation of an open blind pocket for the second surface of the card body and having a bottom part adjacent to the first surface of the card body and step (d) understanding the adherence of the non-contact transaction module to the bottom of the exchange.
    [17]
    Process according to claim 16, characterized in that step (d) comprises the supply of the non-contact transaction module in the form of an adhesive inlay, the adhesive inlay comprising an outer layer configured to be arranged flush with the second surface of the card body, an antenna layer containing the second transaction circuit and the
    Petition 870190062352, of 07/04/2019, p. 40/59
    4/8 antenna, a layer of ferrite and an adhesive layer covered with removable liner paper, where the module's adhesion to the bottom of the pouch comprises first removing the removable liner paper and then pressing the adhesive layer against the bottom of the bag.
    [18]
    18. Process according to claim 14, characterized in that step (c) comprises the formation of a through hole extending from the first surface to the second surface of the cardboard body and step (d) comprises the fixing the non-contact transaction module in the through hole.
    [19]
    19. Process according to claim 18, characterized by the fact that step (d) still comprises the supply of the non-contact transaction module in the form of a multilayer cap or disk that has a first outer layer and a second outer layer , where securing the non-contact transaction module to the void comprises fitting the plug into the through hole so that the first outer layer aligns with the first surface of the card body and the second outer layer aligns with the second surface of the card body.
    [20]
    20. Process according to claim 14, characterized in that step (a) comprises the construction of a metal cardboard body having the construction in two pieces, including a first piece making the first surface and a second piece making concrete the second surface, step (b) comprises the provision of a bag or hole in the first piece to receive the contact-only transaction module, step (c) comprises the provision of through holes aligned in the first piece and the second body part .
    [21]
    21. Process, according to claim 20, characterized by the fact that it still comprises the supply of each of the
    Petition 870190062352, of 07/04/2019, p. 41/59
    5/8 contact-only transaction module and contactless transaction module with at least one flap positioned to be received at an interface between the first part and the second part of the body.
    [22]
    22. Process according to claim 21, characterized by the fact that it still comprises the provision of one or more grooves in the first part, the second part, or both, positioned to receive at least one tab on one of the transaction module contact only and the contactless transaction module.
    [23]
    23. Dual interface transaction card, characterized by the fact that it comprises:
    - a metal cardboard body having first and second surfaces;
    - a first hole in the cardboard body opened for the first surface;
    - a second hole in the cardboard body opened for the second surface;
    - contact pads aligned with the first surface of the card body, mounted on the first hole and connected to a transaction circuit; and
    - a contactless transaction portion attached to the second orifice and coupled to the transaction circuit.
    [24]
    24. Dual interface transaction card according to claim 23, characterized in that the second hole is a pouch and the non-contact transaction portion is adhesively attached to a lower part of the pouch and has an outer layer disposed in level with the second surface of the card body.
    [25]
    25. Dual interface transaction card according to claim 23, characterized in that the non-contact transaction portion still comprises an antenna layer, a ferrite layer and an adhesive layer.
    Petition 870190062352, of 07/04/2019, p. 42/59
    6/8
    [26]
    26. Dual interface transaction card according to claim 23, characterized in that the contact pads are mounted on the transaction circuit and the non-contact transaction portion is connected inductively to the transaction circuit.
    [27]
    27. Dual interface transaction card, according to claim 23, characterized in that the contact pads are mounted on the transaction circuit and the non-contact transaction portion is physically connected to the transaction circuit.
    [28]
    28. Dual interface transaction card according to claim 23, characterized in that the transaction circuit is mounted on the non-contact transaction portion and the contact pads are physically connected to the transaction circuit.
    [29]
    29. Process for making a dual interface transaction card, the process characterized by the fact that it comprises the steps of:
    (a) constructing a metal cardboard body having first and second surfaces;
    (b) forming a pocket that is opened to the second surface and forming a hole in the cardboard body that extends from the first surface to the second surface, where the hole is disposed within the pocket;
    (c) attach a dual interface module to the metal card body, where the dual interface module comprises contact pads connected to a transaction circuit and arranged on the first surface of the card body, extending through the hole and a non-contact transaction portion attached to the exchange and inductively coupled to the transaction circuit.
    [30]
    30. Process according to claim 29, characterized in that the step of fixing the double interface module on the metal card body comprises:
    Petition 870190062352, of 07/04/2019, p. 43/59
    7/8 (i) prepare the dual interface module by connecting the non-contact transaction portion to a plug sized to extend into the hole in the card body; and (ii) embedding the dual interface module in the buffer.
    [31]
    31. Process according to claim 30, characterized in that the step of fixing the double interface module on the metal card body comprises the adhesive bonding of the non-contact transaction portion to an underside of the bag with an outer layer of the non-contact transaction portion disposed flush with the second surface of the card body with the plug disposed in the hole.
    [32]
    32. Process according to claim 31, characterized in that the step of embedding the double interface module in the plug is carried out after the step of connecting the non-contact transaction portion to the bottom of the bag with the plug arranged in the hole .
    [33]
    33. Process according to claim 31, characterized in that the step of embedding the double interface module in the plug is carried out before the connection of the non-contact transaction portion to the bottom of the bag with the plug arranged in the orifice.
    [34]
    34. Process according to claim 30, characterized in that the non-contact transaction portion comprises a multilayer structure comprising a ferrite layer, with at least one layer of the multilayer structure extending to an area underlying the plug, the process comprising creating the ferrite layer with an absence of ferrite in an area positioned to lie behind the plug.
    [35]
    35. Process according to claim 30, characterized in that the non-contact transaction portion comprises a multilayer structure comprising a ferrite layer,
    Petition 870190062352, of 07/04/2019, p. 44/59
    8/8 as the at least one layer of the multilayer structure extending to an area underlying the buffer, the process comprising removing ferrite from the ferrite layer from an area underlying the buffer.
    [36]
    36. Process according to claim 35, characterized in that the step of removing ferrite from the ferrite layer of an area underlying the plug is carried out during the step of embedding the dual interface module in the plug.
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    同族专利:
    公开号 | 公开日
    MX2019008333A|2019-09-16|
    US20190354825A1|2019-11-21|
    EP3568808A1|2019-11-20|
    US20220036149A1|2022-02-03|
    CN110168567A|2019-08-23|
    AU2018208477A1|2019-07-18|
    SG10202106381WA|2021-07-29|
    WO2018132404A1|2018-07-19|
    KR20190105052A|2019-09-11|
    EP3568808A4|2020-08-19|
    CA3049021A1|2018-07-19|
    US11182662B2|2021-11-23|
    JP2020504410A|2020-02-06|
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    法律状态:
    2021-10-13| B350| Update of information on the portal [chapter 15.35 patent gazette]|
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    US201762524063P| true| 2017-06-23|2017-06-23|
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